The company is engaged in R&D of chemicals for the development of composite PCBs.

1.1.1. ADZ100 Micro-etchant

Product Composition: The main components are composite peroxides and organic acids, with synergists and stabilizers as auxiliary components.  

Application Scope: Used for PCB micro-etching and semiconductor-related processes.

Applicable Processes:
  1. Pre-treatment for inner and outer layer dry films (applied in HDI fine circuit processes)
  2. Pre-treatment for PTH micro-etching
  3. Pre-treatment for CuⅠ and CuⅡ micro-etching

Chemical Properties: Stable at room temperature. The active substance of ANSIN DZ100 is the active oxygen (AO) provided by monopersulfuric acid. It has extremely strong and effective non-chlorine oxidation capacity, and can even oxidize chloride ions into chlorine. Its usage and disposal processes meet safety and environmental protection requirements, thus being widely applied in industrial and daily chemical fields.

1.1.2. ADZ200 Micro-etchant

Application Scope: Used for PCB micro-etching and semiconductor-related processes.

Applicable Processes:

  1. Pre-treatment for OSP processes
  2. Pre-treatment for immersion gold and electroplating gold processes
  3. Pre-treatment for immersion tin and immersion silver processes
  4. Pre-treatment for flexible PCBs

Physical Properties: White powdery solid, readily soluble in water.

1.1.3. DZA25P, AN515

This micro-etchant is formulated by compounding DZA25P and DZA200. It is applied for micro-etching treatment of copper surfaces in printed circuit board production, which can uniformly reduce the thickness of copper layers, as well as clean and roughen the copper surfaces. The chemical solution is suitable for micro-etching pre-treatment procedures before dry film or OSP processes.

Its main characteristics are as follows:

1) Stable etching rate, clear and easy-to-maintain solution, free of organic solvents, in compliance with environmental protection requirements;

2) Suitable for micro-etching pre-treatment of selective immersion gold (silver)-OSP boards, which can avoid over-etching and open-circuit defects of copper pads caused by galvanic effect;

3) The copper surface after micro-etching features low roughness, which can improve the solderability of OSP boards and prevent coloration of OSP film surfaces.

a) Application Parameters of the Chemical Solution